Wafer handling stageSemiconductor Stage Components

Stage Component Fabrication Capabilities
• Monolithic structures
• Light-weighted structures
• Bar Mirrors
• Up to meter-class sizes, with full-aperture metrology
• Ultra High Vacuum (UHV) compliant
(cleaning, materials, outgassing tests)
• Bonding, including optical contacting
• “Super” polishing, down to <0.1 nm RMS roughness Stage Component Materials • Glasses (Fused Silica, etc.) • Variety of Ceramics, Silicon Carbide (SiC), etc. • Low thermal expansion materials (Zerodur®, ULE®, CLEARCERAM® etc.) • New, high-performance materials Coatings for Stage Components • Wear resistant • Anti Reflective • Highly Reflective (metal and dielectric) Other characteristics : for wafer handling