The EVG®610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.
The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure modes, with the option of back-side alignment. Moreover the system offers additional capabilities including bond alignment and nanoimprint lithography (NIL). The EVG610 offers quick processing and re-tooling for changing user requirements with a conversion time of less than a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications
Features
Wafer/substrate size from pieces up to 200 mm/8’’
Top-side and bottom-side alignment capability
High-precision alignment stage
Automated wedge compensation sequence
Motorized and recipe-controlled exposure gap
Supports the latest UV-LED technology
Minimized system footprint and facility requirements
Step-by-step process guidance
Remote tech support
Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)
Agile processing and conversion re-tooling
Table top or stand-alone version with anti-vibration granite table
Additional capabilities:
Bond alignment
IR alignment
Nanoimprint lithography (NIL)