The photosensor consists of 6-chip photodiodes produced in planar technology. The photodiodes are passivated with silicon-nitride which acts as an antireflective layer. They are then bonded to the PCB and protected with transparent epoxy glue. The Array can be used in photovoltaic or photoconductive mode.
Features
High responsitivity
Low capacitance
High reliability
Peak wavelength at 830 nm
Shape : flat
Material : glass
Options and accessories : high-reflectivity
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