Flip-chip die bonderAFC Plus

ASM AMICRA’s fully automatic, die bonder / flip chip bonder with exceptionally high precision and placement accuracy (±1µm), a cycle time of <15 sec. as well as a modular machine concept, a flip chip option and much more. The AFCPlus Die Bonder / Flip Chip Bonder has a wide range of features including the following: accuracy ±1µm @ 3S cycle - time < 15 sec assembly of chip and micro-optics (WDM, optoelectronic components, micro-lenses, micro- mechanics) auto loading for substrate wafers epoxy stamping and dispensing eutectic bonding via diode-laser or heating plate passive alignment Optional: flip chip bonding wafer mapping post bond inspection/measurement UV- Curing ... and more! The AFC Die Bonder / Flip Chip Bonder is designed for the following markets: Micro optics LED and MEMS assembly Semiconductor advanced packaging (3D, Stack Die etc.) Dedicated for volume production For questions regarding the AFC Die Bonder / Flip Chip Bonder please contact our worldwide support team. For a more detailed written description, please read below…. ASM AMICRA’s AFCPlus is one of the most advanced die bonding systems on the market today. It is uncommon to find a precision die bonder that can maintain a placement accuracy down to ±1µm @ 3s while bonding with temperatures exceeding 350°C and while also applying high bonding forces. In many cases this type of die bonding can be classified as thermocompression Bonding or TCB. And in other cases these capabilities are also required for through silicon via or TSV. As a larger category of Advanced Packaging Die Attach, the AFCPlus is considered one of the most flexible Die Bonders on the market today. Options : flip-chip, epoxy, automated, for micro assembly, eutectic