Electrolytic copper plating

Copper Plating is electrolytic plating that deposits a layer of copper onto the substrate. This process is typically used to provide an anti-seize surface, as a mask to prevent carburizing on surfaces during heat treating, and to enhance solderability. Copper plating can be used as an under plate for difficult to plate alloys as well as electromagnetic shielding.

Standard Specifications
AMS 2418H
RoHS, REACH, ELV & WEEE Compliant

Performance Benefits
Good Solderability
Excellent Conductivity
Good corrosion when used as undercoat
Inhibits electromagnetic interference with thickness of 1 mil of plating
Throws very well

Receptive Metals
Aluminum Alloy
Aluminum Casting
Stainless Steel
Steel
Brass
Bronze
Copper

Thickness
.0001″-.001″
100-1000 uin.

Max Part Size
24″ x 20″ x 12″
35 pounds per part

Type : electrolytic
Substrate : steel, aluminum, stainless steel, bronze, copper, brass
Certifications : AMS 2418H