Application
Apply to high speed signal PCB transmission of RRU, AAU, BBU;
Product Introduction
Press-fit structure;
92Ω matched differential impedance to strength signal integrity;
Apply to high speed data transmission between mother plate and daughter plate;
56Gbps speed rate can increase to 112Gbps PAM4, 25Gbps line speed;
Technical Parameter
Differential impedance – 92±8Ω
Crosstalk – under 28 GHz, near-end crosstalk≤-35dB, Far-end crosstalk≤-35dB
Data transmission speed – 56Gbps
Inserting loss – under 28 GHz, insertion loss >-3dB
Withstand voltage(Vrms) – Normal temp250V AC
Low level contact resistance –
the shortest differential pair≤ 25mΩ;
the shortest shielding contact≤20mΩ;
Insulation resistance –
normal temp≥1000 MΩ (250V DC);
heat and humid≥20 MΩ (250V DC);
Rated current – 0.5A/pin
Insulation housing – LCP
Contacts – copper alloy,part gold plating, nickel plating
Mechanical life – 250 cycles
Vibration –
Sine vibration: 10 ~2000Hz,147m/s2
Random vibration: RMS 5.2G
Shock – 30g
Operating temp – -55℃~105℃
Salt spray – 48h
Fireproof – UL94 V0
Type : data
Format : PCB
Connection type : press-fit
Electrical characteristics : high-speed, insulation, AC, DC
Material : nickel
Product applications : transmission
Other characteristics : high-speed
Voltage : 250 V
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