skiving heatsink with exactly milled flat semiconductor mounting surface and low roughness depths
particularly suitable for thermoelectric and similar power modules
optimal heat transfer resistance from the base plate to the individual fins, as the heatsinks are made from one piece of material
very good heat conducting aluminum material EN AW 1050 A
extremely compact and high fin density for forced convection
great design flexibility and fast prototyping
skived heatsinks made of copper material on request
heatsink width = length
additional mechanical processing, other designs and dimensions according to customer-specific requirements
thermal resistance: 1.6 – 0.34 K/W
length: 80 mm
thermal resistance: – 1.6 – 0.34 K/W
length: – 80 mm
height: – 46 mm
width: – 80 mm
plate thickness: – 8 mm
material: – aluminium EN AW 1050 A
Material : aluminum
Options : power, compact
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