The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
High Performance at High Accuracy
Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request)
High productivity, low cost-of-ownership
Up to 4 working heads in one machine
Multi-Chip Capability
Single pass production for complex products
Die attach, flip chip, multi-chip in one machine
Epoxy writing & stamping, flux dipping
Die pick from wafer, waffle pack, gel pack, feeder
Die place to carrier, boat, substrate, PCB, lead frame, wafer
Hot and cold processes supported: epoxy, soldering, thermo-compression
MCM, SiP, Hybrids
Open Platform Architecture for Full Customization
Most advanced modular platform concept
Production line tailored 100% to your needs
Ideal solution with smallest footprint possible
Options : high-accuracy, flip-chip, epoxy, automated, for die-attach
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