This platform is a hybrid planar mechanical/air bearing platform dedicated to step and scan applications. It is a 6 axes platform moving in X, Y, Z and Theta directions. Dynamic flatness over the full travel as well as bidirectional repeatability are key parameters.

This platform is currently used in:
– Wafer Process Control applications such as Critical Dimension and Thin film Metrology.
– Wafer scribing
– Wafer Laser Thermal Annealing

It might also be used in Back End Of Line Lithography machines (mask aligners) and in some wafer dicing application.

This platform features:
– Flatness of motion given by the air bearing
– Unlimited rotation in Theta
– Double Z integration: Coarse travel for loading/unloading and fine travel for focus adjustement
– Buit-in gravity compensator in Z (patent pending)
– Yaw correction can be done by slightly shifting the Y1 and Y2 motors
– Can be further integrated with an Active Isolation System fully controlled by ETEL
– Travels in X and Y can be made longer with some limitations on the performance

Main specifications :
– Total stroke: 320 mm for XY x 12 mm for Z
– Speed: 1.2 m/s for XY, 0.1 m/s for Z and 15.7 rad/s for T
– Acceleration: 1.2 g for XY, 0.2 g for Z and 104.7 rad/s2 for T
– Position stability: ±25 nm for XY, ±15 nm for Z and ±0.2 arcsec for T
– Bidirectional repeatability: ±0.4 µm for XY, ±0.3 µm for Z and ±2 arcsec for T

Orientation : linear
Type : motorized
Number of axes : 2-axis
Other characteristics : air bearing
Stroke : Min.: